Development of an automatic management system for plating solution - Syringe Pump XLP6000
Ideal management of plating solutions for semiconductors and electronic components with high reproducibility and precise flow control of the liquid delivery.
Fully compatible with semi-additive manufacturing methods, achieving high reproducibility and easy precise flow rate adjustment, realizing CV of 0.05% at a low cost. Flow rate control from the start with a liquid delivery unit that does not depend on external pressure! Liquid delivery volume range per operation: 1nl to 50ml Volume adjustment unit: minimum 1nl (※) Flow rate range: 0.3μl/min to (5.2nl/sec to) Flow rate adjustment unit: 63nl/min to (1nl/sec) (※) ※ Depends on the capacity of the installed syringe Example: When a 250μl syringe is installed Volume adjustment unit: minimum 5nl Flow rate range: 1.6μl/min to 12.5ml/min (26nl/sec to 208μl/sec) Flow rate adjustment unit: 313nl/min to (5nl/sec) Example: When a 10ml syringe is installed Volume adjustment unit: minimum 0.2μl Flow rate range: 62.5μl/min to 500ml/min (1μl/sec to 8.3ml/sec) Flow rate adjustment unit: 12.5μl/min to (0.2μl/sec to) Robust design reduces service costs for embedded devices and contributes to a lower failure rate of the equipment. High resolution of 6000 or 48,000 steps. Three-way valves to switch liquid paths and up to 12-port valves can be installed.
- Company：テカンジャパン
- Price：100,000 yen-500,000 yen
